Wetting and Soldering Behavior of Eutectic Au-Ge Alloy on Cu and Ni Substrates
نویسندگان
چکیده
منابع مشابه
Cross-interaction of Interfacial Reactions in Ni (au/ni/cu)-snag-cu Solder Joints during Reflow Soldering and Thermal Aging
The coupling effect of interfacial reactions between two pads in Ni-SnAg-Cu and Au/Ni/Cu-SnAg-Cu solder joints was investigated in this paper. After reflow soldering, a large amount of Cu can diffuse across the solder joint to the opposite pad to form (Cu,Ni)6Sn5 IMC on the Ni pad in Ni-SnAg-Cu solder joint. A little Ni can also be detected in Cu6Sn5 layer, which contains some trapped solder, o...
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چکیده ندارد.
15 صفحه اولEffect of soldering techniques and gap distance on tensile strength of soldered Ni-Cr alloy joint
PURPOSE The present study was intended to evaluate the effect of soldering techniques with infrared ray and gas torch under different gap distances (0.3 mm and 0.5 mm) on the tensile strength and surface porosity formation in Ni-Cr base metal alloy. MATERIALS AND METHODS Thirty five dumbbell shaped Ni-Cr alloy specimens were prepared and assigned to 5 groups according to the soldering method ...
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Oleg G. Shpyrko,1,2,* Reinhard Streitel,1 Venkatachalapathy S. K. Balagurusamy,1 Alexei Yu. Grigoriev,1 Moshe Deutsch,3 Benjamin M. Ocko,4 Mati Meron,5 Binhua Lin,5 and Peter S. Pershan1 1Department of Physics and School of Engineering and Applied Sciences, Harvard University, Cambridge, Massachusetts 02138, USA 2Center for Nanoscale Materials, Argonne National Laboratory, Argonne, Illinois 604...
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ژورنال
عنوان ژورنال: Journal of Electronic Materials
سال: 2011
ISSN: 0361-5235,1543-186X
DOI: 10.1007/s11664-011-1639-4